3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

laser cutting alumina ceramic precision made industrial substrate

The ceramic substrate, is a sheet-like material that forms a supporting base for the film circuit component and the externally-applied component on the basis of the electronic ceramic. According to the application field of ceramic substrate, it is divided into HIC (hybrid integrated circuit) ceramic substrate, focusing potentiometer ceramic substrate, laser heating fixing ceramic substrate, chip resistor substrate, network resistor Substrate, etc.; according to different processing methods, ceramic substrates are divided into two types: molded tablets and laser scribe films.

Type of ceramic cutting: alumina zirconia silicon nitride aluminum nitride ceramics;
Cutting the highest precision: ± 0.02;
Cutting maximum size: 1*152.4*152.4mm;
Cutting minimum aperture: diameter φ0.1mm;
Cutting maximum thickness: 1.5mm (mm);
Number of cuts: The more the better.

company information

Wuxi Special Ceramic Co.,Ltd mainly produces alumina, Silicon nitride, Zirconia, Steatite, Boron nitride, Cordierite,mullite products, widely used in metal welding, electronic conductor, mechanics, assembling, insulation, chemicals, instrument, textile, nuclear industry, aerial field.We accept trial produce according to the drawing or sample.It usually takes 30 days to finish trial product.Mass produce usually takes 30 days.Goods' package is carton or PLT.It can be negotiable with each other.
We mainly sell goods to toshiba lighting group in Japan and Europe.Our aim is to deliver goods with high quality at quick delivery date.

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3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates Images